Magnetic storage device

ABSTRACT

A magnetic storage device comprises an array of magnetic memory cells ( 50 ). Each cell ( 50 ) has, in electrical series connection, a magnetic tunnel junction (MTJ) ( 30 ) and a Zener diode ( 40 ). The MTJ ( 30 ) comprises, in sequence, a fixed ferromagnetic layer (FMF) ( 32 ), a non-magnetic spacer layer ( 33 ), a tunnel barrier layer ( 34 ), a further spacer layer ( 35 ), and a soft ferromagnetic layer (FMS) ( 36 ) that can change the orientation of its magnetic moment. The material type and thickness of each layer in the MTJ ( 30 ) is selected so that the cell ( 50 ) can be written by applying a voltage across the cell, which sets the orientation of the magnetic moments of the FMF ( 32 ) and FMS ( 36 ) relative to one another. The switching is effected by means of an induced exchange interaction between the FMS and FMF mediated by the tunneling of spin-polarised electrons in the MTJ ( 30 ). The cell ( 50 ) therefore has low power consumption during write operations allowing for fast writing and dense integration of cells ( 50 ) in an array. The mechanism used to control the array to write and sense the information stored in the cells ( 50 ) is simplified.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 10/364,655filed Feb. 12, 2003 now abandoned, which is a continuation ofapplication Ser. No. 09/830,412 filed Apr. 27, 2001 now abandoned, whichis a 371 of International Application No. PCT/EP99/08368 filed Nov. 2,1999.

FIELD OF THE INVENTION

The present invention relates to non-volatile magnetic random accessmemory (MRAM) storage elements.

BACKGROUND OF THE INVENTION

Important characteristics of mass information storage devices of thefuture should be high speed, low power consumption, low cost and smallsize. To achieve this aim, magnetic random access memories (MRAMs) havebeen proposed due to their non-volatile nature. Unlike dynamic randomaccess memory (DRAM) cells, non-volatile memory cells such as MRAM cellsdo not require a complex circuitry for perpetual electronic refreshingof the information stored, and thus can in principle outperform DRAMcells in all above mentioned characteristics.

The first of such MRAMs were based on magnetic multi-layer structures,deposited on a substrate. U.S. Pat No. 5,343,422, for example, disclosesa structure in which two layers of ferromagnetic material are separatedby a layer of non-magnetic metallic conducting material. One of themagnetic materials, called the ferromagnetic fixed layer (FMF), has afixed direction of magnetic moment, e.g. by having a particularly highcoercive field or strong uni-axial anisotropy. The magnetisation of theother magnetic layer, called the ferromagnetic soft layer (FMS), is freeto change direction between parallel and anti-parallel alignmentrelative to the direction of the magnetic moment of FMF.

The state of the storage element represents a logical “1” or “0”depending on whether the directions of the magnetic moments of themagnetic layers are aligned parallel or anti-parallel, respectively.Because the resistance levels are different for different mutualorientations of the magnetic layers, the structure acts as a spin valve.It thus allows the sensing of the state of the storage element bymeasuring the differential resistance ΔR/R with a current, where ΔR isthe difference in resistance of the storage element for two differentstates of orientation, and R is its total resistance. Due to the highconductance of the device, strong currents are needed to obtain a highenough output voltage signal level for the sensing operation. Aswitching between these orientations can be achieved by passing writecurrents in the vicinity of the FMS, usually by using write lines whichrun past the layered structure on either side. These write currents,which do not pass through the layered structure itself, induce amagnetic field at the location of the FMS which alters the orientationof the FMS, if it is stronger than the coercive field H_(C) of the FMS.

The main disadvantage of this set-up is the relatively high powerconsumption during both write and sense operations due to the highconductance of the structure. For example, conducting thin films havelow sheet resistivities of about 10Ω/μm² leading to cell resistances ofabout 10Ω for currently realisable devices. Such devices require highsense currents of the order of a 0.1 mA in order to get voltage signalsin the region of 1 mV. Therefore MRAM storage devices with higherresistance have been sought for.

An alternative was proposed by J. M. Doughton, J.Appl. Phys., 81, pp.3758–3763 (1997). There, the conducting non-magnetic spacer layerbetween the two magnetic layers is replaced by an insulator. The devicetherefore forms a magnetic tunnel junction (MTJ), where spin polarisedelectrons tunnel through the insulator. It has a high impedance withresistivity values of 10⁴–10⁹Ω/μm², allowing for high speed MRAMs.Further, when put into a two dimensional array such an MRAM cell can becontrolled by just using two lines per cell, the minimum needed tolocate the cell in such an array. Such an array, shown in FIG. 1A isproposed in U.S. Pat. No. 5,640,343, the disclosure of which isincorporated herein by reference.

With reference to FIG. 1A, the memory cell elements are arrangedvertically between parallel electrically conductive word lines 1, 2, 3and bit lines 4, 5, 6. This makes the device topologically simple andallows in principle for a denser array than is achievable with a similarline-width process for DRAMs. The MRAM array shown in FIG. 1A usesmemory cells 9, shown in FIG. 1B, that comprise each a MTJ 8 and a p-ndiode 7 in electrical series connection. The diode 7 is formed as asilicon junction with an n-type layer 10 and a p-type layer 11. It isconnected by an intermediate layer 12 to the MTJ 8, which is formed as aseries of stacked layers comprising a template layer 15, a firstferromagnetic layer 16, a anti-ferromagnetic layer 18 a FMF 20, atunnelling barrier layer 22, a FMS 24 and contact layer 25.

The presence of the diode 7 in the memory cell 9 allows the use of onlytwo lines per cell. The device can be operated such that during a senseoperation only one memory cell in the MRAM will be forward biasedwhereas the remaining cells will either not be biased or reverse biased.Since the reverse bias is always kept below the breakdown voltage of thediode 7, no current flows through these cells.

A cell is written by sending simultaneously a current through the wordand bit line crossing at the location of the cell. Although thesecurrents do not pass through the cell itself, the magnetic field inducedby the current at the location of the FMS is strong enough to switch theorientation of the magnetic moment between its two preferred statesalong the easy axis of the FMS. The FMF, however, has a coercivity thatis high enough such that its magnetic moment is left unchanged in thisprocess. Similarly, in the other memory cells which lie along either thebit or word line used in the switching, the magnetic field induced bythe current passing only in one line is not strong enough to switch theFMS. This set-up however still suffers from high power consumptionduring write operations.

As a consequence of the magnetic fields of the switching currents thedensity of planar integration of MJT cells in an array is also limited.Further, the supporting electric circuitry has to be designed such thatboth write and sense currents can be effected to flow along differentpaths which makes such circuitry quite complex.

SUMMARY OF THE INVENTION

In its first aspect, the present invention comprises a magnetic tunneljunction device comprising first and second stacks of layers of magneticmaterial, each stack comprising at least one layer, the stacks beingseparated by a third stack of layers of non-magnetic material, the thirdstack comprising at least one layer of electrically insulating material,with contacts being made to the first and second stack to apply avoltage across the device, the magnetic materials and insulatingmaterial(s) each being of a type and the said layers each having athickness such that the orientation of the magnetic moments of saidfirst and second stack relative to one another are changeable byapplying a voltage across the device, characterised in that saidorientation can be switched to a first state by applying a first voltageacross the device and that said orientation can be switched to a secondstate applying a second voltage across the device, whereby after eitherswitching the said orientation is maintained when a third voltage isapplied to the device the said third voltage being in between the firstand second voltage.

Preferably, the magnetic tunnel junction device comprises a layer ofnon-magnetic conductive material between at least one of the layers ofmagnetic material in the first or second stack and the at least onelayer of insulating material in the third stack.

Preferably, a single layer of insulating material is provided to form asingle tunnel barrier between the first and second stack. Alternatively,two layers of insulating material separated by a layer of non-magneticconductive material may be provided to form a double tunnel barrier,which can be advantageous due to its special transmissioncharacteristics.

In its second aspect the present invention comprises an array ofmagnetic memory cell devices, said array comprising a first plurality ofconducting leads, a second plurality of conducting leads, each lead inthe said second plurality crossing over each lead in the said firstplurality, a plurality of magnetic memory cell devices, each magneticmemory cell device comprising in electrical series connection a diodeand a magnetic tunnel junction device according to the first aspect ofthe present invention, each magnetic memory cell device being located atan intersection region between one of the first plurality of leads andone of the second plurality of leads, the array having means to apply avoltage to the leads in the first and second plurality such that avoltage drop across a specific memory cell device can be effected thevoltage drop causing the said memory cell device to be written.

In its third aspect the present invention comprises a method ofproviding a magnetic tunnel junction device comprising providing amagnetic tunnel junction comprising first and second stacks of layers ofmagnetic material, each stack comprising at least one layer, the stacksbeing separated by a third stack of layers of non-magnetic material, thethird stack comprising at least one layer of electrically insulatingmaterial, with contacts being made to said first and second stack toapply a voltage across the magnetic tunnel junction the type andthickness of said magnetic and insulating materials being selected suchthat the orientation of the magnetic moments of said first and secondstack relative to one another can be changed by applying a voltageacross the device, characterised in that said orientation can beswitched to a first state by applying a first voltage across the deviceand that said orientation can be switched to a second state applying asecond voltage across the device, whereby after either switching thesaid orientation is maintained when a third voltage is applied to thedevice the said third voltage being in between the first and secondvoltage.

In its fourth aspect the present invention comprises a method ofproviding an array of magnetic memory cell devices comprising providinga first plurality of conducting leads, a second plurality of conductingleads, each lead in the said second plurality crossing over each lead inthe said first plurality, a plurality of magnetic memory cell devices,each magnetic memory cell device comprising in electrical seriesconnection a diode and a magnetic tunnel junction device according tothe third aspect of the present invention, each magnetic memory celldevice being located at an intersection region between one of the firstplurality of leads and one of the second plurality of leads, andproviding means to apply a voltage to the leads in the first and secondplurality such that a voltage drop across a specific memory cell devicecan be effected, the voltage drop causing a magnetic field in the devicethrough tunnelling of spin-polarised electrons which effects the deviceto be written by setting the orientation of the said magnetic momentsrelative to one another.

In this second and fourth aspect the present invention is therefore anMRAM using MTJ elements as memory cells in implementations where bothwrite and sense currents are passing through the cell perpendicularly.The invention utilises the combined effect of the nonlinearcurrent-voltage characteristics of the tunnel process and thenon-equilibrium exchange coupling between the two magnetic layers (N. F.Schwabe et al., Physical Review B 54, pp. 12953–12968 (1996) and R. J.Elliott et al., Journal of Magnetism and Magnetic Materials 177–181, pp.769–770 (1998)).

It has been shown that when a MTJ, and preferably a MTJ comprising anon-magnetic spacer layer (NMS) between the FMS and the barrier layerand between the FMF and the barrier layer, is significantly biased outof equilibrium a strong spin polarised tunnelling current flows throughthe MTJ. At the same time, due to the difference in Fermi-wavevectors oneither side of the MTJ, the exchange interaction changes itscharacteristic periodicity, and becomes a superposition of periodicfunctions with several wavelengths. Further, when the MTJ is biased, astrong spin-current induced exchange interaction (SCE) occurs betweenthe magnetic layers on either side of the MTJ, which has terms thatscale with the voltage and the thickness of the FMF and the FMS. Thisallows changing both the sign and the strength of the exchangeinteraction by applying voltage across the device that is higher than atypical voltage used to sense the device.

Switching occurs when the voltage across the device is strong enough toinduce a spin current across the junction which carries a magnetic fieldH_(E) across the junction that is higher than the coercive field H_(C)of the FMS and that has opposite sign of the alignment of the magneticmoment of the FMS. When the voltage across the MTJ is lowered againafter such switching has been effected the spin-current induced magneticfield H_(E) sinks below the coercive field H_(C) of the FMS, and the FMSremains in the switched state.

In order to switch the device in the opposite direction, the MTJ has tobe designed such that, when the junction is biased reverse the firsttime the SCE exceeds H_(C) of the FMS, the sign of the interaction isopposite that of the SCE when used to switch the FMS using a forwardvoltage. For this purpose, the MTJ has to be designed to have anasymmetric voltage-interaction response. For example the thickness ofthe FMS and the FMH have to be controlled such that thevoltage-interaction response curve scales in relation to H_(C)approximately as shown in FIG. 3, where for forward voltage the firstswitching always occurs towards parallel alignment between the FMS andthe FMF and for reverse voltage to anti-parallel alignment. FIG. 3 willbe described in more detail later.

To sense the orientation of the FMS and FMF relative to one another, aweak sense voltage, that does not affect the orientation of the FMS, isapplied across the device, and the resistance differential of the MTJΔR/R is measured with respect to a given reference orientation similarto that in devices of the prior art.

Being able to switch the FMS by applying a voltage across the memorycell according to the present invention, rather than running strongcurrents past the memory cell which do not flow across the cell,substantially reduces the power consumption of the device and impedanceeffects in the MRAM array. Further, only having to control voltagesacross a memory cell according to the invention, compared with having tocontrol both voltages across cells and currents flowing past cells,reduces the complexity of the electrical circuit driving the MRAM array.

SPECIFIC EMBODIMENTS

Further embodiments of the present invention shall now be described withreference to the accompanying drawings in which:

FIG. 1A shows a perspective view of a MRAM array with magnetic memorycells located vertically between bit and word lines.

FIG. 1B shows an enlarged view of one of the memory cells shown in FIG.1A,

FIG. 2 shows a perspective view of a memory cell according to thepresent invention,

FIG. 3 shows the exchange field—voltage response of an MTJ memory cellin relation to the coercive field H_(C) of the FMS according to theinvention,

FIG. 4 shows schematically the diagram of the electric circuit formed bythe MRAM array, and

FIG. 5 illustrates the voltage levels on the leads in the MRAM arrayaccording to the invention.

FIG. 1A and FIG. 1B have already been described.

CONSTRUCTION AND OPERATION OF THE MEMORY CELL

The memory cell 50 in FIG. 2. is formed as a series of layers similar tothe one disclosed in U.S. Pat. No. 5,640,343, but different in detail.In one of its preferred embodiments the cell comprises an MTJ 30 inseries with a PN junction diode 40. The MTJ comprises a first contactlayer 31, which can be Cu or Pt, a FMF 32 such as Co—Pt—Cr, a first NMS33 such as Cu or Pt, a tunnelling barrier layer 34 such as MgO, a secondNMS 35 such as Cu or Pt, a FMS 36 such as Ni—Fe, and a second contactlayer 37 such as Cu or Pt.

The diode 40 is formed on a semiconductor substrate such as Si andcontains layers of p- and n-doped Si 41 and 42, respectively. Thep-doped region 41 is in contact with the second contact layer 39 and then-doped region 42 is in contact with a word line (not shown). Theinitial contact layer 31 is in contact with the bit line (not shown).Preferably, the diode is formed as a Zener-diode, i.e. it can beoperated through a reverse breakdown voltage in the avalanche breakdownregion.

The FMF 32 and the FMS 36 are fabricated to have easy axes ofmagnetisation that align with one another. By using for the FMF 32 amaterial with particularly high anisotropy such as Co—Pt—Cr thedirection of magnetisation of the easy axis of the FMF 32 is fixedagainst the one of the FMS 36. Alternatively, the direction ofmagnetisation of the FMF 32 can be set by an unidirectional anisotropyas given, for example, in U.S. Pat. No. 5,465,185. For the FMS 36 thereare two possible directions along its easy axis, which define the twostates of the memory cell. In addition the FMS may be fabricated to havea low coercivity by giving it an elliptical shape or forming tapers atthe corners, giving it a hexagonal or octagonal shape, in order tosuppress the effects of edge domains.

There are several differences between this embodiment and the prior art.The properties of the FMF 32 and the FMS 36 are not chosen with regardto their response to writing fields produced by external writingcurrents, but with regard to an optimal current-voltage characteristicsfacilitating both read and write operations by passing a currentperpendicularly through the cell 40. The thickness and magneticproperties of the FMF 32 and the FMS 36 are chosen to achieve anasymmetric SCE which has a voltage response function such as the oneshown in FIG. 3.

The construction of the tunnel barrier 34 is not only determined by thedesired values for ΔR/R to sense the state of the FMS 36, but also toaccommodate switching. Due to its effect on the write performance of thedevice MgO is preferred as a material for the tunnel barrier 36.Alternatively, two layers of insulating material separated by a layer ofnon-magnetic conductive material may be provided to form a double tunnelbarrier.

The presence of the NMSs 33 and 35 on one or both sides of the tunnelbarrier between the FMF 32 and the tunnel barrier 34 as well as the FMS36 and the tunnel barrier 34 is advantageous for the SCE effect as itallows the phase of the exchange interaction across the MTJ to be tuned.This is desirable to ensure that the sign of the SCE can be changed at areasonable voltage level across the MTJ 30. The disadvantage of a verylarge spacer layer is, however, that the SCE decays over distance.Therefore, the right trade-off has to be achieved between appropriatephase and sufficient interaction amplitude in the optimal design of thethickness of both NMSs 33, 35.

Further advantages of the NMSs 33, 35 is that they help to reducelattice mismatch, thus enlarging the range of possible magneticmaterials, and also reduce the number of magnetic impurities in thetunnel barrier 34 which could impair the properties of the MTJ.

Further, the diode 40, formed as a Zener device, accommodates twooperational regimes. One regime for the sense operation similar to theprior art, and the other one during write operations where for writingat least one of the two possible logical states a reverse voltage has tobe applied to the diode 40 that is greater than its breakdown voltage.

It should be noted that although the presence of the NMSs facilitatesthe achievement of the desired characteristics of the MTJ their use isnot strictly necessary and devices are conceivable without their use,but including the same form of operation.

FIG. 3 shows the strength of the exchange interaction, represented bythe exchange field H_(E) versus the voltage drop V across the MTJ 30.When the voltage across the MTJ is increased from the vicinity of zerobeyond the forward bias V_(P), such that H_(E)>H_(C), and lowered backagain to the inception point the FMS 36 will be left in parallelalignment with the FMF 32. Similarly, when V is increased beyond V_(AP),such that H_(E)<−H_(C), and subsequently lowered again to close to zero,the FMS 36 and FMF 32 will be left in anti-parallel alignment A sensingof the cell can be achieved by applying a small sensing voltage V_(S)across the MTJ and measuring the resistance differential ΔR/R withrespect to a given reference value. V_(S) is thereby substantiallysmaller in absolute magnitude than both V_(P) and V_(AP).

It should be noted that the invention is not limited to the use ofsingle layer FMF 32 and FMS 36, which can be replaced by stacks ofmagnetic layers, respectively, in order to tune the magnetic moment,anisotropy, and coercivity of these layers. Similarly the transmissioncharacteristics of the tunnel barrier 34 can be tuned by replacing itwith a double barrier structure that contains a conductive layer betweentwo insulating layers.

Operation of the MRAM Array

An MRAM array according to the present invention has the sametopographic design as the prior art MRAM array of FIG. 1A with thedifference that it contains a memory cell according to the invention ateach node in the array. A circuit diagram of the MRAM array according tothe present invention is shown in FIG. 4, which is also similar to theprior art. As shown FIG. 4 the memory cells 70 to 78 lie at theintersections of the word lines 1, 2, 3 with the bit lines 4, 5, 6,which in turn are connected to the control circuits 51 and 53. Differentfrom the operation of the prior art MRAM, however, a memory cell 70 iswritten by applying a strong voltage to the cell either as a forward orreverse voltage, depending on which way the cell should be switched. Avoltage level diagram of the MRAM array of FIG. 4 in operation is shownin FIG. 5.

In FIG. 5 the cell 70 is first switched to a parallel alignmentrepresenting a logical “1”, then the state of cell 70 is sensed.Subsequently, the cell is switched to an anti-parallel alignmentrepresenting a logical “0” after which the state of the cell is sensedagain.

During the switching to state “1” a voltage V_(F) is applied to bit line4, using circuit 51. At the same time the voltage on bit lines 5 and 6as well as word line 1 are set to zero, while the word lines 2 and 3 arealso biased to the voltage V_(F) using both circuits 51 and 53. Thevoltage V_(F) across memory cell 70 induces a voltage drop V_(P) acrossthe MTJ which, as shown in FIG. 3, is strong enough to switch theorientation of its FMS in the MTJ to a parallel alignment. While thecell 70 is now biased forward at V_(F), cells 71, 72, 73, and 76 areunbiased and cells 74, 75, 77, 78 are reverse biased at −V_(F), which isstill less than the breakdown voltage of the Zener-diode and thereforedoes not lead to a substantial voltage drop across the MTJ.

A sensing operation is carried out by applying a voltage V_(S) to bitline 4, while setting the voltage on word line 1 to zero. At the sametime bit lines 5,6 are kept at zero voltage whereas word lines 2,3 arebiased to V_(S). This way it can be seen that there will be a positivevoltage drop V_(S) across cell 70, whereas all the other cells eitherhave no voltage drop across them or a small reverse voltage −V_(S) whichis smaller than the breakdown voltage of the Zener-diode.

Finally, an operation to write a logical “0” into cell 70 is achieved bysetting the voltage on bit line 4 to −V_(R) while setting the voltage onword line 1 to V_(R). The total voltage drop across cell 70 of −2V_(R)is now such that it is greater than the reverse breakdown voltage of theZener-diode and such that it induces a voltage drop V_(AP) across theMTJ which is strong enough to switch the FMS to “0”, as indicated inFIG. 3. At the same time the voltage on bit lines 5,6 are left at zero,while the voltage on word lines 2,3 are kept at V_(S). Neither of thevoltage drops of −V_(R) and −V_(R)+V_(S) across cells 71, 72 and 73, 76,respectively are high enough to cause a reverse breakdown of theZener-diode, thus avoiding a notable voltage drop across the relevantMTJs.

In the embodiment of the MRAM array described above, voltages areapplied using the control circuits 51,53, such that during either a reador write operation only one cell will be addressed at any one time andthe power consumption of the device is kept to a minimum. The method ofapplying voltages described here is merely an example to which theinvention is not limited, and other combinations of applying voltagesfor operating a memory cell and the MRAM array are conceivable

1. A magnetic tunnel junction device (30) comprising first and secondstacks of layers of magnetic material (32, 36), each stack comprising atleast one layer, the stacks (32, 36) being separated by a third stack oflayers of non-magnetic material, the third stack (34) comprising atleast one layer of electrically insulating material (34), with contacts(31, 36) being made to the first and second stack (32, 36) to apply avoltage across the device, the magnetic materials and insulatingmaterial each being of a type and the said layers each having athickness such that the orientation of the magnetic moments of saidfirst and second stack (32, 36) relative to one another are changeableby applying a voltage across the device, wherein said orientation can beswitched to a first state by applying a first voltage across the deviceand said orientation can be switched to a second state applying a secondvoltage across the device, whereby after either switching the saidorientation is maintained when a third voltage is applied to the device,the said third voltage being in between the first and second voltages.2. The device of claim 1, wherein at least one of the said first andsecond stacks (32, 36) is separated from the third stack (34) by afurther layer of non-magnetic conducting material (33,35).
 3. The deviceof claim 1, wherein the third stack (34) comprises two layers ofinsulating material separated from one another by a layer ofnon-magnetic conductive material.
 4. The device of claim 1, wherein atleast one of the magnetic material in the said first or second stack(32, 36) has a substantially elliptical shape.
 5. The device of claim 1,wherein at least one of the layers of magnetic material in the saidfirst or second stack (32, 36) has a substantially hexagonal oroctagonal shape.
 6. The device of claim 1, wherein easy axes of themagnetization of the said first and second stacks (32, 36) are alignedwith one another such that the orientation of the magnetic moments ofsaid first and second stacks (32, 36) relative to one another arechangeable between substantially parallel and substantiallyanti-parallel states.
 7. The device of claim 6, the magnetic materialsand the insulating material each being of a type and the said layerseach having a thickness causing an asymmetric current response such thatthe changing from the substantially parallel state to the substantiallyanti- parallel state is allowed to be effected by applying a forward orbackward voltage to the device, and wherein the change effected byapplying the forward voltage is opposite to the change effected byapplying the backward voltage.
 8. The device of claim 1, furthercomprising sensing means connected to the said contacts which allows theorientation of the magnetic moments of said first and second stacksrelative to one another to be sensed by applying a fourth voltage acrossthe device and measuring the resistance of the device.
 9. The device ofclaim 8, wherein the fourth voltage applied to the device in order tosense the state of the device is smaller in absolute terms than avoltage applied to the device in order to change the state of thedevice.
 10. The device of claim 1, wherein the said third stackcomprises at least one layer of manganese oxide (MgO).
 11. The device ofclaim 10, wherein easy axes of the magnetization of the said first andsecond stacks (32), (36) are aligned with one another such that thedevice can be switched between two states in which the orientation ofthe magnetic moments of said first and second stacks (32), (36) can bechanged from a substantially parallel alignment to substantiallyanti-parallel alignment by applying one of the said first and secondvoltages to the device and said magnetic moments can be switched from asubstantially anti- parallel alignment to a substantially parallelalignment by applying the other of the said first and second voltages tothe device.
 12. A magnetic tunnel junction device as claimed in claim 1,further comprising a selection device arranged in series therewith. 13.A magnetic tunnel junction device as claimed in claim 12, wherein theselection device comprises a non-linear selection device.
 14. A magnetictunnel junction device as claimed in claim 13, wherein the non-linearselection device comprises a diode.
 15. A magnetic tunnel junctiondevice as claimed in claim 14, wherein the diode comprises a Zenerdiode.
 16. A magnetic memory cell device (50), comprising: a magnetictunnel junction device (30) that comprises first and second stacks oflayers of magnetic material (32, 36), each stack comprising at least onelayer, the stacks (32, 36) being separated by a third stack of layers ofnon- magnetic material, the third stack (34) comprising at least onelayer of electrically insulating material (34), with contacts (31, 36)being made to the first and second stacks (32, 36) to apply a voltageacross the device, the magnetic materials and insulating material eachbeing of a type and the said layers each having a thickness such thatthe orientation of the magnetic moments of said first and second stacks(32,36) relative to one another are changeable by applying a voltageacross the device, wherein said orientation can be switched to a firststate by applying a first voltage across the device and said orientationcan be switched to a second state by applying a second voltage acrossthe device, whereby after either switching the said orientation ismaintained when a third voltage is applied to the device, the said thirdvoltage being in between the first and second voltages; and a diode (40)in electrical series connection with the magnetic tunnel junctiondevice.
 17. The magnetic memory cell device of claim 16, wherein thediode (40) is a Zener diode.
 18. The device of claim 16, comprisingmeans for allowing to effect one of the said voltages required to switchthe relative orientation of the magnetic moments of the said first andsecond stacks (32, 36) in the magnetic tunnel junction device (30) byallowing to apply a further voltage across the magnetic memory celldevice (50), said further voltage effecting a voltage across the diode(40) which is a reverse voltage on the diode, said reverse voltage beinggreater than the breakdown voltage of the diode.
 19. An array ofmagnetic memory cell devices as claimed in claim 16 comprising a firstplurality of conducting leads (1-3), a second plurality of conductingleads (4-6), each lead in the said second plurality (4-6) crossing overeach lead in the said first plurality (1-3), a plurality of magneticmemory cell devices (10-78), each magnetic memory cell device beinglocated at an intersection region between one of the first plurality ofleads (1-3) and one of the second plurality of leads (4-6), the arrayhaving means for applying a voltage to the leads (51,53) in the firstand second plurality (1-3), (4-6) such that a voltage drop across aspecific memory cell device can be effected, the voltage drop causingthe said specific memory cell device to be written by setting theorientation of said magnetic moments relative to one another.
 20. Amethod of providing a magnetic tunnel junction device (30) comprisingproviding a magnetic tunnel junction comprising first and second stacksof layers of magnetic material (32, 36), each stack comprising at leastone layer, the stacks being separated by a third stack of layers ofnon-magnetic material (36), the third stack comprising at least onelayer of electrically insulating material (34), with contacts (31, 37)being made to said first and second stack (32, 36) to apply a voltageacross the magnetic tunnel junction, the type and thickness of saidmagnetic and insulating materials being selected such that theorientation of the magnetic moments of said first and second stacks (32,36) relative to one another can be changed by applying a voltage acrossthe device, wherein said orientation can be switched to a first state byapplying a first voltage across the device and said orientation can beswitched to a second state applying a second voltage across the device,whereby after either switching the said orientation is maintained when athird voltage is applied to the device, the said third voltage being inbetween the first and second voltages.
 21. The method of claim 20,further comprising providing two layers of insulating material in thesaid third stack (34), which two layers of insulating material areseparated from one another by a layer of non-magnetic conductivematerial.
 22. The method of claim 20, wherein at least one of the layersof magnetic material in the said first or second stack is providedhaving a substantially elliptical shape.
 23. The method of claim 20,wherein at least one of the layers of magnetic material in the saidfirst or second stack (32, 36) is provided having a substantiallyhexagonal or octagonal shape.
 24. The method of claim 20, furthercomprising providing a layer of non-magnetic conductive material (33,35) between the said third stack (34) and at least one of the said firstand second stacks (32, 36).
 25. The method of claim 20, wherein theorientation of the magnetic moments of said first and second stacks (32,36) relative to one another can be changed between substantiallyparallel and substantially anti- parallel states.
 26. The method ofclaim 25, wherein changing from the substantially parallel state to thesubstantially anti-parallel state is effected by applying a forward orbackward voltage to the device, wherein the change effected by applyingthe forward voltage is opposite the change effected by applying thebackward voltage.
 27. The method of claim 20, wherein the orientation ofthe magnetic moments of said first and second stacks (32, 36) relativeto one another can be sensed by applying a fourth voltage across themagnetic tunnel junction device (30) and measuring the resistance of thedevice.
 28. The method of claim 27, wherein the fourth voltage appliedto the device in order to sense the orientation of the magnetic momentsof the said first and second stacks (32, 36) relative to one another issmaller in absolute terms than the voltage applied to the device inorder to change the relative alignment of said magnetic moments.
 29. Themethod of claim 20, wherein the said third stack (34) is provided withat least one layer of manganese oxide (MgO).
 30. The method of claim 29,wherein the device can be switched between two states in which theorientation of the magnetic moments of said first and second stacks(32,36) can be changed from a substantially parallel alignment tosubstantially anti-parallel alignment by applying one of the said firstand second voltages to the device and said magnetic moments can beswitched from the substantially anti-parallel alignment to thesubstantially parallel alignment by applying the other of the said firstand second voltages to the device.
 31. The method of claim 20, furthercomprising providing a diode (40) in electrical series connection withthe magnetic tunnel junction device (30) to form a magnetic memory celldevice (50).
 32. The method of claim 31, wherein the diode (40) is aZener diode.
 33. The method of claim 31, wherein one of the saidvoltages required to switch the relative orientation of the magneticmoments of said first and second stacks (32, 36) in the magnetic tunneljunction device (30) is effected by applying a further voltage acrossthe magnetic memory cell (50) device, said further voltage effecting avoltage across the diode which is a reverse voltage on the diode (40),said reverse voltage being greater than the breakdown voltage of thediode (40).
 34. A method of providing an array of magnetic memory celldevices, comprising: providing a first plurality of conducting leads(1-3), a second plurality of conducting leads (4-6), each lead in thesaid second plurality (4-6) crossing over each lead in the said firstplurality (1-3); and providing a plurality of magnetic memory celldevices (70-78) each having a magnetic tunnel junction comprising firstand second stacks of layers of magnetic material (32, 36), each stackcomprising at least one layer, the stacks being separated by a thirdstack of layers of non-magnetic material (36), the third stackcomprising at least one layer of electrically insulating material (34),with contacts (31, 37) being made to said first and second stacks (32,36) to apply a voltage across the magnetic tunnel junction, the type andthickness of said magnetic and insulating materials being selected suchthat the orientation of the magnetic moments of said first and secondstacks (32, 36) relative to one another can be changed by applying avoltage across the device, wherein said orientation can be switched to afirst state by applying a first voltage across the device and saidorientation can be switched to a second state applying a second voltageacross the device, whereby after either switching the said orientationis maintained when a third voltage is applied to the device, the saidthird voltage being in between the first and second voltages, and adiode (40) in electrical series connection with a corresponding magnetictunnel junction, said each magnetic memory cell device being located atan intersection region between one of the first plurality of leads (1-3)and one of the second plurality of leads (4-6), and providing means forapplying a voltage to the leads (51, 53) in the first and secondplurality (1-3), (4-6) such that a voltage drop across a specific memorycell device can be effected, the voltage drop causing a magnetic fieldin the device through tunnelling of spin-polarised electrons whicheffects the device to be written by setting the orientation of the saidmagnetic moments relative to one another.
 35. A magnetic memory celldevice (50), comprising: a magnetic tunnel junction device (30) thatcomprises first and second stacks of layers of magnetic material (32,36), each stack comprising at least one layer, the stacks (32, 36) beingseparated by a third stack of layers of non- magnetic material, thethird stack (34) comprising at least one layer of electricallyinsulating material (34), with contacts (31, 36) being made to the firstand second stacks (32, 36) to apply a voltage across the device, themagnetic materials and insulating material each being of a type and thesaid layers each having a thickness such that the orientation of themagnetic moments of said first and second stacks (32, 36) relative toone another are changeable by applying a voltage across the device,wherein said orientation can be switched to a first state by applying afirst voltage across the device and said orientation can be switched toa second state applying a second voltage across the device, wherebyafter either switching the said orientation is maintained when a thirdvoltage is applied to the device, the said third voltage being inbetween the first and second voltages; and a selection device inelectrical series connection with the magnetic tunnel junction device.36. A magnetic memory cell device as claimed in claim 35, wherein theselection device comprises a non-linear selection device.
 37. Themagnetic memory cell device of claim 36, wherein the non-linearselection device is a diode.
 38. The magnetic memory cell device ofclaim 37, wherein the diode in a Zener diode.
 39. An array of magneticmemory cell devices as claimed in claim 36 comprising a first pluralityof conduction leads (1-3), a second plurality of conducting leads (4-6),each lead in the said second plurality (4-6) crossing over each lead inthe said first plurality (1-3), a plurality of magnetic memory celldevices (70-78), each magnetic memory cell device being located at anintersection region between one of the first plurality of leads (1-3)and one of the second plurality of leads (4-6), the array having meansfor applying a voltage to the leads (51,53) in the first and secondplurality (1-3), (4-6) such that a voltage drop across a specific memorycell device can be effected, the voltage drop causing the said specificmemory cell device to be written by setting the orientation of saidmagnetic moments relative to one another.
 40. The magnetic memory celldevice of claim 35, comprising means for allowing to effect one of thesaid voltages required to switch the relative orientation of themagnetic moments of the said first and second stacks (32, 36) in themagnetic tunnel junction device (30) by allowing to apply a furthervoltage across the magnetic memory cell device (50), said furthervoltage effecting a voltage across the selection device which is areverse voltage on the selection device, said reverse voltage beingsufficiently large for the selection device to conduct.
 41. An array ofmagnetic memory cell devices as claimed in claim 35, comprising a firstplurality of conduction leads (1-3), a second plurality of conductingleads (4-6), each lead in the said second plurality (4-6) crossing overeach lead in the said first plurality (1-3), a plurality of magneticmemory cell devices (70-78), each magnetic memory cell device beinglocated at an intersection region between one of the first plurality ofleads (1-3) and one of the second plurality of leads (4-6), the arrayhaving means for applying a voltage to the leads (51,53) in the firstand second plurality (1-3), (4-6) such that a voltage drop across aspecific memory cell device can be effected, the voltage drop causingthe said specific memory cell device to be written by setting theorientation of said magnetic moments relative to one another.